Housekeeping Chemical Raw Materials
Chemical Products Range
High-quality raw materials used in housekeeping and cleaning formulations, ensuring effective hygiene, safety, and long-lasting performance.
Coco Di Ethanolamide (CDEA)
Coco Diethanolamide (CDEA) is an important electroplating chemical used as a wetting and foam-stabilizing agent to improve bath performance and surface finish.
Cocomono Diethanolamine (CMEA)
Cocomono Diethanolamine (CMEA) is an effective electroplating chemical used as a surfactant and foam booster to enhance bath stability and surface quality.
S.L.E.S
S.L.E.S (Sodium Lauryl Ether Sulphate) is an important electroplating chemical used as a surfactant and wetting agent to improve cleaning efficiency and uniform metal deposition.
I.P.A
I.P.A (Isopropyl Alcohol) is a widely used electroplating chemical employed as a cleaning and degreasing agent to remove oils and contaminants from metal surfaces.
B.K.C
B.K.C (Benzalkonium Chloride) is an effective electroplating chemical used as a disinfectant and corrosion inhibitor to maintain bath hygiene and enhance plating quality.
E.G.M.S
E.G.M.S (Ethylene Glycol Monostearate) is an important electroplating chemical used as a surfactant and leveling agent to improve bath stability and achieve a smooth, uniform metal finish.
Acid Thickner
Acid Thickener is a specialized electroplating chemical used to increase the viscosity of acidic plating baths, ensuring uniform metal deposition and improved surface finish.
PDCB
PDCB (Para-Dichlorobenzene) is an electroplating chemical used as a solvent and stabilizer to maintain bath efficiency and support consistent metal coating quality.
Pine Oil
Pine Oil is an important electroplating chemical used as a cleaning and wetting agent to remove grease and impurities, ensuring a smooth and uniform metal surface.
Oleic Acid
Oleic Acid is a key electroplating chemical used as a wetting and leveling agent to improve metal deposition and achieve a smooth, uniform surface finish.
Soft soap
Soft Soap is an essential electroplating chemical used as a cleaning and emulsifying agent to remove oils and contaminants, ensuring a smooth and uniform metal surface.
Butyl Cello Solve
Butyl Cellosolve is a widely used electroplating chemical serving as a solvent and cleaning agent to remove grease and impurities, ensuring effective surface preparation.
Feldspar
Feldspar is an important electroplating chemical used as a flux and stabilizer to improve coating adhesion and achieve a smooth, uniform metal finish.”
Solubilizer
Solubilizer is a key electroplating chemical used to dissolve and stabilize ingredients in plating baths, ensuring uniform metal deposition and consistent surface quality.
Polymer
Polymer is an essential electroplating chemical used to enhance bath stability, improve metal deposition, and achieve a smooth, uniform surface finish.
Sodium Hypo Chlorite
Sodium Hypochlorite is a widely used electroplating chemical employed for cleaning, disinfection, and oxidation to remove contaminants and maintain bath hygiene.
Sodium Dichloro Iso Cyanuric Acid(SDCC)
Sodium Dichloroisocyanurate (SDCC) is an effective electroplating chemical used as a disinfectant and sanitizer to maintain hygiene and prevent microbial contamination in plating baths
Coumene
Coumene is an important electroplating chemical used as a solvent and flux component to improve metal deposition and ensure a smooth, uniform surface finish.
Dipentine
Dipentine is a specialized electroplating chemical used as a solvent and cleaning agent to remove grease and impurities, ensuring effective surface preparation for plating.
Sodium Lauryl Sulphate(SLS)
Sodium Lauryl Sulphate (SLS) is a key electroplating chemical used as a surfactant and wetting agent to enhance cleaning efficiency and ensure uniform metal deposition.
